Google Pixel 11 Pro Fold Design Unveiled in CAD Renders: Sleeker Body and Enhanced Camera Module

by

Ganpat Singh Chouhan

Google Pixel 11 Pro Fold Design Unveiled in CAD Renders: Sleeker Body and Enhanced Camera Module

Mumbai, March 10: A recent leak has unveiled the design of the upcoming Google Pixel 11 Pro Fold smartphone. OnLeaks collaborated with Android Headlines to share these detailed renders. According to the visuals, Google is maintaining a consistent design approach with this new model.

The Pixel 11 Pro Fold retains the general shape of its predecessor, with corner curvature that appears largely unchanged. The foldable main display features a hole-punch camera cutout located in the top right corner. The bezels surrounding the display are uniform and thin, with slight elevation to protect the flexible screen when folded. The bottom edge includes a USB-C port, microphone, speaker grille, and SIM tray, while small openings on the top edge likely serve as microphone or antenna placements.

The most notable visual update is the redesigned camera module. This new design showcases cleaner lines and better integration with the rear panel. The LED flash and microphone are now positioned within the upper pill-shaped cutout alongside one camera, rather than outside the module. A curved junction between the camera island and backplate enhances the visual flow. The flat rear panel prominently displays the centered Google logo.

Physical buttons remain in their traditional locations, with the power button positioned above the volume controls. The frame is constructed from aluminum, complemented by a glass back panel. The device’s dimensions indicate a slight reduction in thickness. The height remains at 155.2mm, with an unfolded width of 150.4mm. The folded thickness has decreased to 10.1mm (14.9mm with the camera bump), down from the Pixel 10 Pro Fold’s 10.8mm. When unfolded, the thickness measures 4.8mm (9.6mm with the bump), compared to the previous model’s 5.2mm. This marks a reduction of 0.7mm when folded and 0.4mm when unfolded.

Additionally, the device is expected to feature internal upgrades, including the new Tensor G6 processor. This chip is rumored to be manufactured using TSMC’s 3nm process and may include a 7-core CPU configuration. Enhancements to the camera system are also anticipated compared to the previous model, although specific details regarding the camera setup have yet to be disclosed. More information is expected to emerge as the anticipated launch in August 2026 approaches.

My name is Ganpat Singh Choughan. I am an experienced content writer with 7 years of expertise in the field. Currently, I contribute to Daily Kiran, creating engaging and informative content across a variety of categories including technology, health, travel, education, and automobiles. My goal is to deliver accurate, insightful, and captivating information through my words to help readers stay informed and empowered.

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