New Delhi, May 29: The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India. This announcement was made by Union Electronics and IT Minister Ashwini Vaishnaw on Friday.
On the social media platform X, Vaishnaw congratulated the state government, Intel, and 3DGS for signing the agreement aimed at establishing substrate manufacturing capabilities in India.
The ministry stated in a post, “Congratulations to the Odisha government, Intel, and 3DGS for signing the MoU to bring substrate manufacturing technology to India. This will further enhance the semiconductor ecosystem in the country.”
Recently, the semiconductor ecosystem in Odisha has been rapidly expanding. In April, the foundation stone was laid for the country’s first advanced 3D chip packaging unit in Bhubaneswar’s Info Valley, under a project initiated by 3D Glass Solutions (3DGS) focusing on heterogeneous integration packaging solutions.
According to the government, this project, with an investment of approximately ₹2,000 crores, is expected to produce around 70,000 glass panels annually, along with 5 million assembled units and about 13,000 advanced 3D heterogeneous integration (3DHI) modules.
At that time, Union Minister Ashwini Vaishnaw stated that under Prime Minister Narendra Modi’s leadership, India’s semiconductor sector is rapidly developing, with Odisha playing a crucial role in the country’s semiconductor ambitions.
Additionally, Chief Minister Mohan Charan Majhi noted that Odisha is the only state in India where the first compound semiconductor fabrication unit and the first 3D glass substrate packaging facility are being established.
This development comes at a time when the central government continues to strengthen the domestic semiconductor ecosystem by providing policy support and incentives under the Semicon India program.
Earlier this week, the government announced that 12 fab or packaging projects and 24 semiconductor design projects have already been approved under this program.
Furthermore, to boost investor confidence and address industry concerns, the government has launched an online investor assistance portal.
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