Samsung has begun testing its next-generation processor, the Exynos 2700, shortly after launching the Exynos 2600. The new chip was recently spotted in an early Geekbench listing, highlighting significant changes from its predecessor.
The Exynos 2700 features a four-cluster CPU design with a total of 10 cores. These include one core clocked at 2.30GHz, four cores at 2.40GHz, one core at 2.78GHz, and four cores running at 2.88GHz. This contrasts with the Exynos 2600’s three-cluster layout, which houses one core at 3.8GHz, three cores at 3.26GHz, and six cores at 2.76GHz.
According to well-known tipster Abhishek Yadav, the test device running the Exynos 2700 operated on Android 16, with 12GB of RAM, and featured the new Xclipse 970 GPU. This GPU replaces the Xclipse 960 found in the Exynos 2600. However, on paper, the Xclipse 970 appears less powerful, offering four compute units, a maximum frequency of 555MHz, and 1GB of device memory. In comparison, the Xclipse 960 has eight compute units, a peak frequency of 980MHz, and 4GB of device memory. The OpenCL score for the new GPU dropped to 15,618 from approximately 25,791 seen on Exynos 2600 devices.
These benchmark results are likely from an Engineering Reference Device, which is used for early internal testing and typically runs at lower clock speeds with incomplete software. Therefore, final retail performance is expected to be higher once the processor is officially launched.
Samsung introduced the Exynos 2600 in December 2024 alongside the Galaxy S26 series in select markets. The Exynos 2700 is anticipated to power future flagship smartphones, although Samsung has not yet confirmed the specific models. The shift to a 10-core, four-cluster architecture indicates that Samsung is experimenting with new processor configurations ahead of the official release.
Previous reports have identified the Exynos 2700 as a key flagship chip for 2027, codenamed Ulysses, likely intended for the Galaxy S27 series. It is expected to be manufactured using Samsung Foundry’s second-generation 2nm SF2P process, incorporating Gate-All-Around technology to enhance performance and energy efficiency. Rumours also suggest the inclusion of next-generation ARM C2 CPU cores, advanced thermal packaging, a new AMD-based Xclipse GPU, LPDDR6 memory, and UFS 5.0 storage.
My name is Bhupendra Singh Chundawat. I am an experienced content writer with several years of expertise in the field. Currently, I contribute to Daily Kiran, creating engaging and informative content across a variety of categories including technology, health, travel, education, and automobiles. My goal is to deliver accurate, insightful, and captivating information through my words to help readers stay informed and empowered.
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