New Delhi, September 20 (Daily Kiran) : The largest semiconductor conference in India, Semicon India 2026, has provided a significant platform for investment and technological partnerships. Held in New Delhi, the event attracted over 600 exhibitors and nearly 300 international companies from 52 countries.
During the conference, 56 memorandums of understanding (MOUs) were signed, focusing on design, manufacturing, and research initiatives. According to government statements, this fifth flagship semiconductor conference marks a substantial step forward in the development of India’s domestic semiconductor ecosystem.
This year’s event featured six country pavilions, including representatives from Japan, South Korea, Malaysia, the Netherlands, Singapore, and Sweden. Additionally, there were pavilions from 12 states, a startup pavilion, a workforce development zone, an innovation showcase, and a student hackathon, all highlighting various aspects of the semiconductor value chain.
The conference saw a total of 51,656 registrations, with approximately 40,000 attendees present. Prime Minister Narendra Modi inaugurated Semicon India 2026, stating that India has progressed from policy discussions and project planning to the era of commercial semiconductor production.
During the event, PM Modi engaged with young chip designers and students, virtually inaugurating two new commercial production lines at CDIL Semiconductor in Mohali and Suchi Semicon in Surat. Furthermore, five units from the 12 projects approved under Semicon 1.0 are now fully operational.
The Prime Minister also outlined the framework for Semicon 2.0, aimed at enhancing capabilities across all levels of the semiconductor value chain. A budget of ₹127,500 crore has been allocated for this initiative, which is structured around six pillars: design, machinery and materials, new fabs, advanced packaging, research, and talent development.
Over the three-day event, the 56 MOUs and announcements covered areas such as semiconductor design, fabrication, advanced packaging, equipment and materials, power electronics, AI, high-performance computing, R&D, logistics, technology commercialization, skilling, and workforce development. The conference facilitated major collaborations and investment plans among semiconductor manufacturers, equipment companies, design firms, educational institutions, and skilling organizations.
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