
Mumbai, April 27: MediaTek has launched the Dimensity 7450 and 7450X chipsets, successors to last year’s Dimensity 7400 and 7400X. These new models do not represent a generational leap but rather a refresh of the existing lineup. Their names reflect this continuity.
There is no upgrade in the CPU; both chipsets utilize the same octa-core configuration. This includes 4 Cortex-A78 cores operating at 2.6 GHz and 4 Cortex-A55 cores at 2.0 GHz. The GPU remains the Mali-G615 MC2.
One notable enhancement is in AI capabilities, which have improved by 7%. MediaTek emphasizes that this boost is particularly beneficial for AI tasks related to photography.
The primary upgrade in these new System-on-Chips (SoCs) lies in connectivity. They now feature the new 5G R17 modem, replacing the previous R16. This modem promises greater power efficiency and improved performance through 3CC carrier aggregation. Additionally, it offers a 20% performance increase during transit and enables faster recovery of network connections when exiting dead zones.
What distinguishes the Dimensity 7450 from the Dimensity 7450X? The latter supports dual-display setups, making it an excellent choice for budget-friendly foldable smartphones.
The first devices equipped with these SoCs are expected to enter the market in the coming months.



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